UET 191 First-Year Seminar. (1–3)
not regularly offered

UET 194 Special Topics. (1–4)
not regularly offered

UET 294 Special Topics. (1–4)
not regularly offered

UET 331 Electronic Materials. (3)
fall only
Physical, chemical, electromagnetic, and mechanical properties of electronic materials. Solid-state device characteristics and their material properties. Prerequisites: CHM 113; EET 208; PHY 112, 114.

UET 411 Applied Vacuum Technology. (3)
spring only
Fundamentals, applications, and practical aspects of vacuum systems and their uses in semiconductor fabrication. Prerequisite: UET 331.

UET 415 Electronic Manufacturing Engineering Principles. (3)
fall and spring only
Electronic equipment design and fabrication principles and practice. Completion of electronics hardware design project and report. Lecture, lab. Fee or deposit. Prerequisite: EET senior standing (113 hours).

UET 416 Monolithic Integrated Circuit Devices. (3)
fall only
Physics and electronics of bipolar and MOS devices used in integrated circuits. Prerequisite: UET 331. Corequisite: UET 417.

UET 417 Monolithic Integrated Circuit Laboratory. (2)
fall only
Laboratory practice in the fabrication of integrated circuits. Lab. Prerequisite: UET 331. Corequisite: UET 416.

UET 418 Hybrid Integrated Circuit Technology. (4)
spring only
Layout, fabrication, design, and manufacture of thin and thick film hybrid circuits. Lecture, lab. Prerequisites: EET 310; UET 331.

UET 421 Applied Device Physics. (3)
fall only
Band structures of solids, physics of current carriers in solids, pn junctions, MOS and bipolar transistors. Prerequisite: senior standing in the department.

UET 424 Integrated Circuit Mask Making Technology. (3)
fall only
Fundamentals, applications, and techniques for the fabrication of integrated circuit masks. Prerequisite: UET 331.

UET 426 Software Tools for the Semiconductor Industry. (3)
spring only
Introduction to software tools commonly used in the semiconductor industry, such as SUPREM IV, PSPICE, VIEWLOGIC, and ICED. Cross-listed as CET 426. Credit is allowed for only CET 426 or UET 426. Prerequisite: UET 331.

UET 432 Semiconductor Packaging and Heat Transfer. (3)
spring only
Packaging theory and techniques; hermetic and plastic assembly; thermal management; electrical characteristics and reliability. Prerequisites: ETC 340; UET 331 (or their equivalents).

UET 437 Integrated Circuit Testing. (3)
spring only
Principles, techniques, and strategies employed at wafer level and final product testing, both destructive and nondestructive. Prerequisite: UET 416.

UET 485 Digital Testing Techniques I. (3)
once a year
Hardware/software aspects of digital testing technology; systems, board, and logic testing and equipment. Lecture, lab. Cross-listed as CET 485. Credit is allowed for only CET 485 or UET 485. Prerequisites: CET 350; EET 310.

UET 484 Internship. (1–12)
fall and spring only

UET 492 Honors Directed Study. (1–6)
not regularly offered

UET 493 Honors Thesis. (1–6)
not regularly offered

UET 494 Special Topics. (1–4)
not regularly offered

UET 498 Pro-Seminar. (1–7)
not regularly offered

UET 499 Individualized Instruction. (1–3)
not regularly offered

UET 513 VLSI Circuit Design and Layout. (3)
fall only
Techniques and practice for the design and layout of very large-scale integrated (VLSI) circuits. Emphasis on “system on silicon” using tools for computer-aided design layout. Seminar. Prerequisite: UET 416.

UET 516 Semiconductor Process Simulation and Integration. (3)
spring only
Modern IC processes and process integration; design of modern IC processes using SUPREM. Lecture, lab. Prerequisite: UET 416.

UET 518 Hybrid IC Technology and Applications. (3)
spring only
Theory, processing, fabrication, and manufacturing of hybrid microelectronics devices and products. Applications. Prerequisite: UET 331 (or its equivalent) or instructor approval.

UET 521 Device Physics. (3)
fall only
Band structure of solids, electron hole-pairs, mobility, lifetime, fermilevel, pn junctions, diodes, and bipolar and MOS transistors. Prerequisite: graduate standing in the department.

UET 532 IC Packaging. (3)
spring only
IC packaging theory and techniques; assembly techniques, material issues; thermal management; electrical performance and reliability. Lecture, lab. Prerequisites: ETC 340; UET 331 (or their equivalents).

UET 580 Practicum. (1–12)
not regularly offered

UET 584 Internship. (1–12)
not regularly offered

UET 590 Reading and Conference. (1–12)
not regularly offered

UET 591 Seminar. (1–12)
not regularly offered

UET 592 Research. (1–12)
not regularly offered

UET 593 Applied Project. (1–12)
not regularly offered

UET 594 Conference and Workshop. (1–12)
not regularly offered

UET 595 Continuing Registration. (1)
not regularly offered

UET 598 Special Topics. (1–4)
not regularly offered

UET 599 Thesis. (1–12)
not regularly offered

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